Invention Grant
- Patent Title: Sensor module and sensor system
- Patent Title (中): 传感器模块和传感器系统
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Application No.: US13976372Application Date: 2011-11-24
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Publication No.: US09279827B2Publication Date: 2016-03-08
- Inventor: Daisuke Maeda , Heewon Jeong , Masahide Hayashi
- Applicant: Daisuke Maeda , Heewon Jeong , Masahide Hayashi
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2010-291015 20101227
- International Application: PCT/JP2011/077070 WO 20111124
- International Announcement: WO2012/090627 WO 20120705
- Main IPC: G01P21/00
- IPC: G01P21/00 ; G01C19/5776 ; G01C21/16

Abstract:
Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part 10 receives a signal output from a signal processing part 7 before passing through a low-pass filter 8, analyzes whether or not application of a fragile frequency with respect to a physical quantity is equal to or more than a threshold level, if the application of the fragile frequency is equal to or more than the threshold level, outputs output stop signals to output signal control parts 9, 16. The output signal control parts 9, 16 receive control signals output from the signal component analysis part 10, and outputs an acceleration signal and a physical quantity signal from which noise has been removed by the low-pass filters 8, 15 through the signal processing parts 7, 14.
Public/Granted literature
- US20130319075A1 Sensor Module and Sensor System Public/Granted day:2013-12-05
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