Invention Grant
- Patent Title: Probe card and fabricating method thereof
- Patent Title (中): 探针卡及其制造方法
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Application No.: US13587895Application Date: 2012-08-16
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Publication No.: US09279831B2Publication Date: 2016-03-08
- Inventor: Chun-Yen Tsai , Nien-Tsung Hsueh
- Applicant: Chun-Yen Tsai , Nien-Tsung Hsueh
- Applicant Address: TW Hsinchu Science Park, Hsin-Chu
- Assignee: NOVATEK Microelectronics Corp.
- Current Assignee: NOVATEK Microelectronics Corp.
- Current Assignee Address: TW Hsinchu Science Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW101118939A 20120528
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/073 ; G01R31/28 ; G01R3/00

Abstract:
A probe card includes a circuit board and an integrated circuit (IC) test interface. The IC test interface includes a first probe assembly, disposed on a terminal of the circuit board, and a second probe assembly, disposed on another terminal of the circuit board, wherein the first probe assembly and the second probe assembly are separated to allow being independently assembled to, or disassembled from, the circuit board. Each of the first probe assembly and the second probe assembly includes a probe base, disposed on the circuit board; a plurality of needles, which are cantilever needles; and a covering layer, for covering the plurality of needles, and fixed on a surface of the probe base.
Public/Granted literature
- US20130162281A1 Probe Card and Fabricating Method Thereof Public/Granted day:2013-06-27
Information query