Invention Grant
US09279852B2 Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings
有权
用于将测试工具与具有固定和可更换衬套的插座的集成电路器件型材一致的系统和方法
- Patent Title: Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings
- Patent Title (中): 用于将测试工具与具有固定和可更换衬套的插座的集成电路器件型材一致的系统和方法
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Application No.: US13941404Application Date: 2013-07-12
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Publication No.: US09279852B2Publication Date: 2016-03-08
- Inventor: Nasser Barabi , Chee Wah Ho , Joven R. Tienzo , Oksana Kryachek , Elena V. Nazarov
- Applicant: ESSAI, INC.
- Applicant Address: US CA Fremont
- Assignee: Essai, Inc.
- Current Assignee: Essai, Inc.
- Current Assignee Address: US CA Fremont
- Agent Kang S. Lim
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/28 ; G01R1/04
Abstract:
A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing.
Public/Granted literature
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