Invention Grant
- Patent Title: Test probe card structure
- Patent Title (中): 测试卡结构
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Application No.: US14446628Application Date: 2014-07-30
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Publication No.: US09279853B2Publication Date: 2016-03-08
- Inventor: Chien-Yao Hung , Chih-Yao Chen
- Applicant: HERMES-EPITEK CORP.
- Applicant Address: TW Taipei
- Assignee: Hermes-Epitek Corp.
- Current Assignee: Hermes-Epitek Corp.
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: TW099129378A 20100831
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/28

Abstract:
A test probe card structure includes a probe card and a connection circuit common plate. The probe card includes a probe substrate, A test circuit board is disposed between the probe substrate and the connection circuit common plate, The test circuit board has a lest circuit connection section attached to and electrically connected with a common circuit adaptation section of the connection circuit common plate. A circuit extension section is formed around the connection circuit common plate, which is all-channel electrically connectable between a tester and the teat circuit connection section. The connection circuit common plate serves to provide an all-channel test circuit convergence connection ability for the test circuit board so as to greatly minify the size of the test circuit board and lower the manufacturing cost of the probe card.
Public/Granted literature
- US20140340109A1 TEST PROBE CARD STRUCTURE Public/Granted day:2014-11-20
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