Invention Grant
US09279856B2 Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
有权
芯片,芯片,驱动芯片或芯片的方法以及制造芯片或芯片的方法
- Patent Title: Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
- Patent Title (中): 芯片,芯片,驱动芯片或芯片的方法以及制造芯片或芯片的方法
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Application No.: US13656761Application Date: 2012-10-22
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Publication No.: US09279856B2Publication Date: 2016-03-08
- Inventor: Peter Laackmann , Marcus Janke
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner
- Main IPC: G01R31/3187
- IPC: G01R31/3187 ; H01L21/50 ; H01L23/544 ; G01R31/317

Abstract:
In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclonable function circuit on the die, wherein the self-test circuit is configured to provide at least one test input signal to the physical unclonable function circuit and to determine as to whether the output signal provided in response to the at least one test input signal fulfills a predefined criterion.
Public/Granted literature
- US20140111234A1 Die, Chip, Method for Driving a Die or a Chip and Method for Manufacturing a Die or a Chip Public/Granted day:2014-04-24
Information query
IPC分类: