Invention Grant
- Patent Title: Wafer level optical lens structure
- Patent Title (中): 晶圆级光学透镜结构
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Application No.: US14159818Application Date: 2014-01-21
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Publication No.: US09279964B2Publication Date: 2016-03-08
- Inventor: Yun-Lien Hsiao , Shu-Hao Hsu
- Applicant: HIMAX TECHNOLOGIES LIMITED
- Applicant Address: TW Tainan
- Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee Address: TW Tainan
- Agency: J.C. Patents
- Priority: TW102129558A 20130816
- Main IPC: G02B13/00
- IPC: G02B13/00 ; B29D11/00
Abstract:
A wafer level optical lens structure is provided. A stress buffer layer is disposed between a light-transmissive substrate and a lens layer, so as to improve production yield of the wafer level optical lens.
Public/Granted literature
- US20140204467A1 WAFER LEVEL OPTICAL LENS STRUCTURE Public/Granted day:2014-07-24
Information query
