Invention Grant
US09280044B2 Light-reflective photomask and mask blank for EUV exposure, and manufacturing method of semiconductor device
有权
用于EUV曝光的光反射光掩模和掩模板,以及半导体器件的制造方法
- Patent Title: Light-reflective photomask and mask blank for EUV exposure, and manufacturing method of semiconductor device
- Patent Title (中): 用于EUV曝光的光反射光掩模和掩模板,以及半导体器件的制造方法
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Application No.: US14021726Application Date: 2013-09-09
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Publication No.: US09280044B2Publication Date: 2016-03-08
- Inventor: Kosuke Takai
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2013-039952 20130228
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/22

Abstract:
According to one embodiment, a light-reflective photomask including a circuit pattern area, and an outside area positioned outside the circuit pattern area includes a substrate, a low-reflectivity layer provided in both the circuit pattern area, and the outside area, formed on the substrate, including at least a conductive layer, and comprising a first reflectivity for deep ultraviolet light, a multilayer reflection layer provided in the circuit pattern area, and formed on the low-reflectivity layer, and a light-absorber provided in the circuit pattern area, formed on the multilayer reflection layer, including a circuit pattern, and comprising a second reflectivity for deep ultraviolet light. The first reflectivity is lower than or equal to the second reflectivity.
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