Invention Grant
- Patent Title: Semiconductor device including plural chips stacked to each other
- Patent Title (中): 包括彼此堆叠的多个芯片的半导体装置
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Application No.: US14564219Application Date: 2014-12-09
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Publication No.: US09281050B2Publication Date: 2016-03-08
- Inventor: Chikara Kondo
- Applicant: PS4 LUXCO S.A.R.L.
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.a.r.l.
- Current Assignee: PS4 Luxco S.a.r.l.
- Current Assignee Address: LU Luxembourg
- Agency: Kunzler Law Group, PC
- Priority: JP2011-080393 20110331
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G11C11/409 ; G11C5/06 ; G11C11/4063 ; G11C11/4076

Abstract:
A method for reading data from a plurality of DRAM devices connected to common command, address, and data busses. A clock signal is provided to the plurality of DRAM devices. A read command and address to the plurality of DRAM devices on the command and address busses in synchronization with the clock signal. A read clock signal is provided to the plurality of DRAM devices to initiate a read operation in one of the plurality of DRAM devices that is selected by the address. The one DRAM device delays the read clock signal by an amount based on a speed of the one of the plurality of DRAM devices to generate. First delayed read clock and second delayed read clock signals are provided. The read data is received on the data bus in synchronization with the second delayed read clock signal.
Public/Granted literature
- US20150092505A1 SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER Public/Granted day:2015-04-02
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