Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
-
Application No.: US14517565Application Date: 2014-10-17
-
Publication No.: US09281051B2Publication Date: 2016-03-08
- Inventor: Kyu Bong Kong , Kwang Jin Na
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0078887 20140626
- Main IPC: G11C11/34
- IPC: G11C11/34 ; G11C11/4096 ; G11C7/10 ; G11C5/02 ; G11C5/06
Abstract:
A semiconductor package may include a first die and a second die disposed adjacent to the first die. The semiconductor package may include a plurality of pads configured for receiving and outputting data mask addresses. The semiconductor package may include mapping blocks configured to map data mask signals among the first die, the second die, and the plurality of pads in response to a received address.
Public/Granted literature
- US20150380075A1 SEMICONDUCTOR PACKAGE Public/Granted day:2015-12-31
Information query
