Invention Grant
- Patent Title: Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof
- Patent Title (中): 各向异性导电材料及其制造方法，以及安装体及其制造方法
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Application No.: US13806506Application Date: 2011-06-21
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Publication No.: US09281096B2Publication Date: 2016-03-08
- Inventor: Shinichi Hayashi , Hiroshi Hamachi
- Applicant: Shinichi Hayashi , Hiroshi Hamachi
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-140502 20100621
- International Application: PCT/JP2011/064159 WO 20110621
- International Announcement: WO2011/162256 WO 20111229
- Main IPC: C09J9/02
- IPC: C09J9/02 ; H01B1/20 ; C08L23/08 ; C08L71/00 ; C09D167/00 ; C09J129/14 ; H01B1/22 ; H01R4/04 ; C09J123/08 ; C08K5/14 ; C08L63/10 ; C08L67/07 ; C08L75/16 ; C08L79/08
Abstract:
A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.
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