Invention Grant
- Patent Title: Electric wire holding structure and electric wire holding method
- Patent Title (中): 电线保持结构和电线保持方法
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Application No.: US13869715Application Date: 2013-04-24
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Publication No.: US09281099B2Publication Date: 2016-03-08
- Inventor: Yutaka Terasaka
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2010-244977 20101101
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01R4/02 ; H01R43/02 ; H01B13/00

Abstract:
An electric wire holding structure includes a plurality of electric wires each including a conductive part provided with a plurality of core wires and an insulating part covering the conductive part. The conductive part includes a rectangular conductive part which is formed at an end of the conductive part to have a rectangular outer shape in a section perpendicular to an extending direction of the electric wires. The rectangular conductive parts of the respective electric wires are bonded together by welding with ultrasonic vibration. The rectangular conductive parts of a plurality of the electric wires are piled in a brick laying manner to be bonded by welding.
Public/Granted literature
- US20130233591A1 ELECTRIC WIRE HOLDING STRUCTURE AND ELECTRIC WIRE HOLDING METHOD Public/Granted day:2013-09-12
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