Invention Grant
- Patent Title: Multilayer ceramic electronic component and manufacturing method thereof
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13909859Application Date: 2013-06-04
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Publication No.: US09281121B2Publication Date: 2016-03-08
- Inventor: Byung Kwon Yoon , Min Gon Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0029355 20130319
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/008 ; H01G4/30 ; H01G4/012
Abstract:
There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided.
Public/Granted literature
- US20140285946A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-09-25
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