Invention Grant
- Patent Title: Method for manufacturing nitride semiconductor device
- Patent Title (中): 氮化物半导体器件的制造方法
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Application No.: US14397589Application Date: 2013-04-19
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Publication No.: US09281187B2Publication Date: 2016-03-08
- Inventor: Ken Sato , Hirokazu Goto , Hiroshi Shikauchi , Keitaro Tsuchiya , Masaru Shinomiya , Kazunori Hagimoto
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-112109 20120516
- International Application: PCT/JP2013/002647 WO 20130419
- International Announcement: WO2013/171975 WO 20131121
- Main IPC: H01L21/36
- IPC: H01L21/36 ; H01L21/02 ; C23C16/30 ; C30B25/02 ; C30B29/40 ; H01L29/778 ; H01L29/15 ; H01L33/32 ; H01L29/20

Abstract:
The invention provides a method for manufacturing a nitride semiconductor device that grows a multilayer film of a III-V group nitride semiconductor in a reaction furnace into which a III group element raw material gas and a V group element raw material gas are introduced, the method including: growing a first nitride semiconductor layer at a first raw material gas flow rate of the V group element raw material gas and a first carrier gas flow rate; and growing a second nitride semiconductor layer at a second raw material gas flow rate of the V group element raw material gas lower than the first raw material gas flow rate and a second carrier gas flow rate higher than the first carrier gas flow rate, wherein the first nitride semiconductor layer and the second nitride semiconductor layer are stacked.
Public/Granted literature
- US20150126018A1 METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE Public/Granted day:2015-05-07
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