Wafer and method of fabricating the same

Invention Grant

US09281189B2 Wafer and method of fabricating the same 有权

Title translation: 晶圆及其制造方法

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Patent Title: Wafer and method of fabricating the same
Patent Title (中): 晶圆及其制造方法
Application No.: US14354858

Application Date: 2012-10-26
Publication No.: US09281189B2

Publication Date: 2016-03-08
Inventor: Moo Seong Kim
Applicant: Moo Seong Kim
Applicant Address: KR Seoul
Assignee: LG INNOTEK CO., LTD.
Current Assignee: LG INNOTEK CO., LTD.
Current Assignee Address: KR Seoul
Agency: Saliwanchik, Lloyd & Eisenschenk
Priority: KR10-2011-0109730 20111026
International Application: PCT/KR2012/008906 WO 20121026
International Announcement: WO2013/062380 WO 20130502
Main IPC: H01L21/8238
IPC: H01L21/8238 ; H01L21/02 ; C30B25/16 ; C30B29/06 ; H01L29/16 ; H01L29/34

Wafer and method of fabricating the same

Abstract:

Disclosed is a method of manufacturing a thin film, the method including: growing an epitaxial layer on a surface of a wafer at a growth temperature, wherein the growing of the epitaxial layer comprises controlling a defect present on a surface of the wafer. Also, disclosed is a wafer including: a substrate; and an epitaxial layer located on the substrate, wherein a basal dislocation density of the epitaxial layer is equal to or less than 1/cm2.

Abstract(Chinese):

公开了一种制造薄膜的方法，该方法包括：在生长温度下在晶片的表面上生长外延层，其中外延层的生长包括控制晶片表面上存在的缺陷。此外，公开了一种晶片，包括：基板; 以及位于所述衬底上的外延层，其中所述外延层的基底位错密度等于或小于1 / cm 2。

Public/Granted literature

US20140284627A1 WAFER AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-09-25

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS