Invention Grant
US09281197B2 Epitaxial substrate for solid-state imaging device with gettering sink, semiconductor device, back illuminated solid-state imaging device and manufacturing method thereof 有权
具有吸收槽,半导体器件,背照式固态成像器件的固态成像器件的外延衬底及其制造方法

  • Patent Title: Epitaxial substrate for solid-state imaging device with gettering sink, semiconductor device, back illuminated solid-state imaging device and manufacturing method thereof
  • Patent Title (中): 具有吸收槽,半导体器件,背照式固态成像器件的固态成像器件的外延衬底及其制造方法
  • Application No.: US13124578
    Application Date: 2009-10-16
  • Publication No.: US09281197B2
    Publication Date: 2016-03-08
  • Inventor: Kazunari Kurita
  • Applicant: Kazunari Kurita
  • Applicant Address: JP Tokyo
  • Assignee: SUMCO CORPORATION
  • Current Assignee: SUMCO CORPORATION
  • Current Assignee Address: JP Tokyo
  • Agency: Greenblum & Bernstein, P.L.C.
  • Priority: JPP2008-267341 20081016; JPP2008-267342 20081016; JPP2008-267343 20081016; JPP2009-069601 20090323
  • International Application: PCT/JP2009/005428 WO 20091016
  • International Announcement: WO2010/044279 WO 20100422
  • Main IPC: H01L31/02
  • IPC: H01L31/02 H01L21/268 H01L21/322 H01L27/146 C30B29/06
Epitaxial substrate for solid-state imaging device with gettering sink, semiconductor device, back illuminated solid-state imaging device and manufacturing method thereof
Abstract:
A semiconductor wafer is set in a laser irradiation apparatus, and laser beam irradiation is performed while the semiconductor wafer is moved. At this time, a laser beam emitted from a laser generating apparatus is condensed by a condensing lens so that the condensing point (focal point) is positioned at a depth of several tens ofμm or so from one surface of the semiconductor wafer. Thereby, the crystal structure of the semiconductor wafer in the position having such a depth is modified, and a gettering sink is formed.
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