Invention Grant
- Patent Title: Coupling system
- Patent Title (中): 耦合系统
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Application No.: US13702493Application Date: 2011-05-30
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Publication No.: US09281223B2Publication Date: 2016-03-08
- Inventor: Shiro Hara
- Applicant: Shiro Hara
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens Olson & Bear LLP
- Priority: JP2010-131470 20100608
- International Application: PCT/JP2011/062331 WO 20110530
- International Announcement: WO2011/155355 WO 20111215
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/677

Abstract:
In a transfer system for wafers, etc., a coupling chamber corresponding to a port is formed only when a transfer box comes in tight contact with an apparatus as a transfer target in the transfer box is transferred into the apparatus, so that the transfer target will be transferred into the apparatus together with the coupling chamber, thereby simplifying the structures of the transfer box and apparatus and also allowing the transfer target to be transferred into the apparatus without fail.
Public/Granted literature
- US20130153462A1 COUPLING SYSTEM Public/Granted day:2013-06-20
Information query
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