Invention Grant
- Patent Title: Semiconductor package including a connecting member
- Patent Title (中): 包括连接构件的半导体封装
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Application No.: US14501577Application Date: 2014-09-30
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Publication No.: US09281257B2Publication Date: 2016-03-08
- Inventor: Jun Woo Myung , Sung Min Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0163959 20131226
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/495 ; H01L23/00
Abstract:
The semiconductor package according to an exemplary embodiment in the present disclosure includes: at least one electronic device; a lead frame including a plurality of leads electrically connected to the electronic device; a lead connecting member coupled to at least one of the leads; and a molded portion sealing the electronic device and the lead connecting member.
Public/Granted literature
- US20150187684A1 SEMICONDUCTOR PACKAGE Public/Granted day:2015-07-02
Information query
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