Invention Grant
- Patent Title: Packaging structure of a semiconductor device
- Patent Title (中): 半导体器件的封装结构
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Application No.: US14488586Application Date: 2014-09-17
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Publication No.: US09281265B2Publication Date: 2016-03-08
- Inventor: Yueh-Se Ho , Yan Xun Xue , Jun Lu , Lei Shi , Liang Zhao , Ping Huang
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/06 ; H01L21/78 ; H01L23/492 ; H01L21/56 ; H01L23/31
Abstract:
A method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip, encapsulating the lead frame and the semiconductor chip with a second plastic package body with top surfaces of conductive contact bodies electrically connected to electrodes on the top surface of the semiconductor chip exposed and plating conductive pads on a top surface of the assembly structure to provide external electrical connections to the electrodes through the conductive contact bodies.
Public/Granted literature
- US20150021753A1 PACKAGING STRUCTURE OF A SEMICONDUCTOR DEVICE Public/Granted day:2015-01-22
Information query
IPC分类:
