Invention Grant
- Patent Title: Semiconductor package having overhang portion
- Patent Title (中): 具有突出部分的半导体封装
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Application No.: US14549704Application Date: 2014-11-21
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Publication No.: US09281267B1Publication Date: 2016-03-08
- Inventor: Yong Tae Jun
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0108716 20140821
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/49 ; H01L23/498 ; H01L23/00
Abstract:
A semiconductor package may include a substrate, and a structural body disposed over the substrate. The semiconductor package may include a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging out over the side surface of the structural body. The semiconductor package may include one or more bonding pads disposed on the overhang portion, and one or more wires electrically coupling the bonding pads to the substrate. The semiconductor package may include a wire fixing film attached onto the structural body, and overhanging out over the side surface of the structural body to fix the one or more wires.
Public/Granted literature
- US20160056122A1 SEMICONDUCTOR PACKAGE HAVING OVERHANG PORTION Public/Granted day:2016-02-25
Information query
IPC分类:
