Microelectronic packages and methods for fabricating microelectronic packages having texturized solder pads, which can improve solder joint reliability, are provided. In one embodiment, the method includes forming a texturized dielectric region having a texture pattern, such as a hatch pattern, in an under-pad dielectric layer. A texturized solder pad is produced over the texturized dielectric region. The texturized solder pad has a solder contact surface to which the texture pattern is transferred such that the area of the solder contact surface is increased relative to a non-texturized solder pad of equivalent dimensions.