Invention Grant
US09281348B2 Display panel and fabricating method thereof 有权
显示面板及其制造方法

Display panel and fabricating method thereof
Abstract:
A display panel and a fabricating method thereof are provided, and the display panel (100) comprises: a first substrate (11); a second substrate (12), arranged parallel to the first substrate; an anode/cathode (41), formed on the first substrate; a cathode/anode (42), formed on the second substrate; a first alignment layer (31), provided on the anode/cathode and comprising a plurality of first sub-alignment layers (311) having a first alignment direction and a plurality of second sub-alignment layers (312) having a second alignment direction alternately arranged in a first direction, and a angle between the first alignment direction and the second alignment direction being 90 degrees; a second alignment layer (32), provided on the cathode/anode and comprising a plurality of third sub-alignment layers (323) having the first alignment direction and a plurality of fourth sub-alignment layers (324) having the second alignment direction alternately arranged in the first direction, and the first sub-alignment layers corresponding to the third sub-alignment layers in a position, and the second sub-alignment layers corresponding to the fourth sub-alignment layers in a position; and a light emitting layer (40), provided between the first alignment layer and the second alignment layer, which comprises a liquid crystal polymer doped with organic light emitting material and is configured to emit a polarized light.
Public/Granted literature
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/02 .按其半导体本体的特征区分的
H01L29/06 ..按其形状区分的;按各半导体区域的形状、相对尺寸或配置区分的
H01L29/08 ...具有连接到1个通有待整流、放大或切换的电流的电极上去的半导体区域的;并且这样的电极又是包含3个或更多个电极的半导体器件的组成部分的
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