Invention Grant
- Patent Title: Metal gate structure and manufacturing method thereof
- Patent Title (中): 金属栅结构及其制造方法
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Application No.: US14334004Application Date: 2014-07-17
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Publication No.: US09281372B2Publication Date: 2016-03-08
- Inventor: Shin-Jiun Kuang , Tsung-Hsing Yu , Yi-Ming Sheu , Chun-Yi Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/00 ; H01L29/49 ; H01L29/51 ; H01L21/28

Abstract:
The present disclosure provides a semiconductor structure includes a gate structure disposed over a substrate, wherein the gate structure includes a high-k dielectric layer and a work function structure. The high-k dielectric layer includes a base portion and a side portion, the side portion is extended from an end of the base portion, the side portion is substantially orthogonal to the base portion. The work function structure includes a first metal disposed over the high-k dielectric layer and a second metal disposed over the first metal and including a bottom portion and a sidewall portion extended from an end of the bottom portion, wherein the first metal includes different materials from the second metal, and a length of an interface between the sidewall portion and the bottom portion to a length of the bottom portion within the high-k dielectric layer is in a predetermined ratio.
Public/Granted literature
- US20160020297A1 METAL GATE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-01-21
Information query
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