Invention Grant
- Patent Title: Semiconductor device and fabrication method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13875418Application Date: 2013-05-02
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Publication No.: US09281395B2Publication Date: 2016-03-08
- Inventor: Min Gyu Lim , Jung Hwan Lee , Yi Sun Chung
- Applicant: MAGNACHIP SEMICONDUCTOR, LTD.
- Applicant Address: KR Cheongju-si
- Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR10-2012-0085905 20120806
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/78 ; H01L29/66 ; H01L27/092 ; H01L29/423 ; H01L29/06 ; H01L29/08

Abstract:
A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a P type well region and an N type well region formed in a substrate, a gate insulating layer having a non-uniform thickness and formed on the P type well region and the N type well region, a gate electrode formed on the gate insulating layer, a P type well pick-up region formed in the P type well region, and a field relief oxide layer formed in the N type well region between the gate electrode and the drain region.
Public/Granted literature
- US20140035033A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2014-02-06
Information query
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