Invention Grant
- Patent Title: Pressure sensing apparatuses and methods
- Patent Title (中): 压力传感装置及方法
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Application No.: US13229324Application Date: 2011-09-09
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Publication No.: US09281415B2Publication Date: 2016-03-08
- Inventor: Zhenan Bao , Stefan Christian Bernhardt Mannsfeld , Jason Locklin , Benjamin Chee-Keong Tee
- Applicant: Zhenan Bao , Stefan Christian Bernhardt Mannsfeld , Jason Locklin , Benjamin Chee-Keong Tee
- Applicant Address: US CA Stanford
- Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US CA Stanford
- Agency: Crawford Maunu PLLC
- Main IPC: G01R27/26
- IPC: G01R27/26 ; H01L29/84 ; G01L1/14 ; H01L51/00 ; H01L51/05

Abstract:
Sensors, sensing arrangements and devices, and related methods are provided. In accordance with an example embodiment, an impedance-based sensor includes a flexible dielectric material and generates an output based on pressure applied to the dielectric material and a resulting compression thereof. In certain embodiments, the dielectric material includes a plurality of regions separated by gaps and configured to elastically deform and recover in response to applied pressure.
Public/Granted literature
- US20120062245A1 Pressure Sensing Apparatuses and Methods Public/Granted day:2012-03-15
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