Invention Grant
US09281417B1 GaN-based schottky diode having large bond pads and reduced contact resistance
有权
GaN基肖特基二极管具有大的接合焊盘和降低的接触电阻
- Patent Title: GaN-based schottky diode having large bond pads and reduced contact resistance
- Patent Title (中): GaN基肖特基二极管具有大的接合焊盘和降低的接触电阻
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Application No.: US14627013Application Date: 2015-02-20
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Publication No.: US09281417B1Publication Date: 2016-03-08
- Inventor: Yih-Yin Lin
- Applicant: Vishay General Semiconductor LLC
- Applicant Address: US NY Hauppauge
- Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
- Current Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
- Current Assignee Address: US NY Hauppauge
- Agency: Mayer & Williams PC
- Agent Stuart H. Mayer
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L29/872 ; H01L29/20 ; H01L29/205 ; H01L29/417 ; H01L29/06

Abstract:
A semiconductor device includes a first active layer disposed over a substrate. The second active layer is disposed on the first active layer. The second active layer has a higher bandgap than the first active layer such that a two-dimensional electron gas layer arises between the first active layer and the second active layer. The first electrode establishes a Schottky junction with the second active layer. The first electrode includes a first electrode pad and a first series of fingers in electrical contact with the first electrode pad. The second electrode establishes an ohmic junction with the first active layer. The second electrode includes a second electrode pad and a second series of fingers in electrical contact with the second electrode pad. The first and second series of electrode fingers form an interdigitated pattern. The first electrode pad is located over the first and second series of electrode fingers.
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