Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US13996892Application Date: 2011-12-27
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Publication No.: US09282227B2Publication Date: 2016-03-08
- Inventor: Hyunah Oh
- Applicant: Hyunah Oh
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2010-0135633 20101227
- International Application: PCT/KR2011/010135 WO 20111227
- International Announcement: WO2012/091399 WO 20120705
- Main IPC: G02B7/02
- IPC: G02B7/02 ; H04N5/225 ; G03B17/55

Abstract:
The present invention relates to a camera module mounted with an external look-forming holder improved in heat emission function, the camera module including: a housing; a lens insertion hole opened toward an upper surface of the housing for insertion of a lens; a filter attachment unit formed on a floor surface of the housing for attaching a filter; and a heat emission outlet formed on an upper surface of the lens insertion hole in an upper-wide/bottom-narrow shape, wherein a heat emission outlet is formed at an upper surface of a lens insertion hole to induce heat generated from inside of a housing to be emitted to outside along an inner side of the heat emission outlet.
Public/Granted literature
- US20130293972A1 CAMERA MODULE Public/Granted day:2013-11-07
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
G02B7/02 | .用于透镜 |