Invention Grant
- Patent Title: Rotatable heating-cooling plate and element in proximity thereto
- Patent Title (中): 可旋转的加热冷却板和靠近其的元件
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Application No.: US12686276Application Date: 2010-01-12
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Publication No.: US09282592B2Publication Date: 2016-03-08
- Inventor: Jui-Chun Peng , Jacky Chung , Heng-Hsin Liu , Chun-Hung Lin
- Applicant: Jui-Chun Peng , Jacky Chung , Heng-Hsin Liu , Chun-Hung Lin
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H05B3/68
- IPC: H05B3/68 ; H01L21/67 ; H01L21/68 ; H05B3/14 ; H05B1/02
Abstract:
An apparatus for selectively heating/cooling one or more substrates and establishing an approximately uniform temperature in the one or more substrates during a heating or cooling event is described. In one embodiment, the apparatus comprises a rotatable hot/cold plate onto which the one or more substrates are placed and a heating/cooling element disposed in close proximity to the rotatable hot/cold plate for selectively elevating/lowering the temperature of the one or more substrates.
Public/Granted literature
- US20100219175A1 ROTATABLE PLATE AND HEATING/COOLING ELEMENT IN PROXIMITY THERETO Public/Granted day:2010-09-02
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