Invention Grant
- Patent Title: Contact pad carrier strip and method for making same
- Patent Title (中): 接触垫载体带及其制造方法
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Application No.: US13893899Application Date: 2013-05-14
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Publication No.: US09282636B2Publication Date: 2016-03-08
- Inventor: Anthony Woodford , Calvin Linfield , Vincent Daniel Jean Salle , Kenneth Senior
- Applicant: Johnson Electric S.A.
- Applicant Address: CH Murten
- Assignee: JOHNSON ELECTRIC S.A.
- Current Assignee: JOHNSON ELECTRIC S.A.
- Current Assignee Address: CH Murten
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201210182012 20120605; CN201210265907 20120730
- Main IPC: H05K1/00
- IPC: H05K1/00 ; G06K19/06 ; H05K1/14 ; H05K1/02 ; H05K3/00 ; G06K19/077 ; H05K1/11

Abstract:
A contact pad carrier strip includes a substrate having a lateral extent of or substantially of 35 mm or a multiple of or substantially of 35 mm, and at least three smart card contact pads formed along the lateral extent of the substrate. The contact pads are aligned widthwisely across the lateral extent of the substrate. Each smart card contact pad includes a plurality of contacts. A majority of contacts of the contact pads are oriented to extend widthwisely across the lateral extent of the carrier strip.
Public/Granted literature
- US20130319733A1 CONTACT PAD CARRIER STRIP AND METHOD FOR MAKING SAME Public/Granted day:2013-12-05
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