Invention Grant
US09282639B2 Adhesive composition, adhesive varnish, adhesive film and wiring film
有权
粘合剂组合物,粘合剂清漆,粘合膜和布线膜
- Patent Title: Adhesive composition, adhesive varnish, adhesive film and wiring film
- Patent Title (中): 粘合剂组合物,粘合剂清漆,粘合膜和布线膜
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Application No.: US14103131Application Date: 2013-12-11
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Publication No.: US09282639B2Publication Date: 2016-03-08
- Inventor: Daisuke Shanai , Takashi Aoyama , Kazuhiko Sasada , Hiroaki Komatsu
- Applicant: HITACHI METALS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2012-271140 20121212; JP2013-213268 20131011
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J171/08 ; H05K1/02 ; H05K1/09 ; H05K3/38 ; H05K3/20 ; C08G18/64 ; C08G18/81 ; C09J171/00 ; C09J175/16 ; C08L79/08

Abstract:
An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.
Public/Granted literature
- US20140158413A1 ADHESIVE COMPOSITION, ADHESIVE VARNISH, ADHESIVE FILM AND WIRING FILM Public/Granted day:2014-06-12
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