Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.