Invention Grant
- Patent Title: System for manufacturing laminated circuit boards
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Application No.: US14341901Application Date: 2014-07-28
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Publication No.: US09282651B2Publication Date: 2016-03-08
- Inventor: Anthony Faraci , Gary N. Sortino
- Applicant: DUETTO INTEGRATED SYSTEMS, INC.
- Applicant Address: US NY Islandia
- Assignee: DUETTO INTEGRATED SYSTEMS, INC.
- Current Assignee: DUETTO INTEGRATED SYSTEMS, INC.
- Current Assignee Address: US NY Islandia
- Agency: Lackenbach Siegel, LLP
- Agent Andrew F. Young, Esq.
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/46 ; H05K1/02

Abstract:
The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.
Public/Granted literature
- US20140332162A1 SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS Public/Granted day:2014-11-13
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