Invention Grant
- Patent Title: Gaskets for thermal ducting around heat pipes
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Application No.: US13719022Application Date: 2012-12-18
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Publication No.: US09282656B2Publication Date: 2016-03-08
- Inventor: Brett W. Degner , William F. Leggett , Jay S. Nigen , Frank F. Liang , Richard H. Tan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K5/02 ; F28D15/02 ; B23P15/26 ; H05K7/20 ; G06F1/20 ; F28D1/02

Abstract:
The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.
Public/Granted literature
- US20130329357A1 GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES Public/Granted day:2013-12-12
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