Invention Grant
- Patent Title: Electronic apparatus and method for assembling the same
- Patent Title (中): 电子装置及其组装方法
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Application No.: US14080801Application Date: 2013-11-15
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Publication No.: US09282668B2Publication Date: 2016-03-08
- Inventor: Ying-Yen Cheng , Yu-Jing Liao
- Applicant: HTC Corporation
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K7/06 ; H04N5/257 ; H04M1/02 ; H05K5/00 ; H05K7/00

Abstract:
An electronic apparatus including a housing, a first circuit board, a battery module, a display module and a second circuit board is provided. The housing has at least an opening and an accommodating space. The first circuit board is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the first circuit board. The display module is disposed in the accommodating space and stacked over the battery module, wherein the display module is visible through the opening. The second circuit board is disposed in the accommodating space and disposed under the display module, beside the battery module.
Public/Granted literature
- US20140118960A1 ELECTRONIC APPARATUS AND METHOD FOR ASSEMBLING THE SAME Public/Granted day:2014-05-01
Information query