Heat conducting mounting structure for mounting of electronic modules, comprising first surface area that is adapted to face a second surface area of the electronic module; cavity means embedded at a distance from the first surface area; said cavity means is adapted to receive a cooling means; attachment means at the first surface area adapted for attaching the electronic module; and wherein the attachment means is adapted for a transfer of the heat energy from the electronic module to the mounting structure. Further a method for mounting the electronic module on the heat conducting mounting comprising the step of adjoining an attachment means with a fixing means and the fixing means with the electronic module to obtain at least one immediate connection pressure area between the first surface area of a wall and the second surface area of the electronic module. Also a radio base station housing arrangement is provided.