A fluid handling device includes a substrate, a film, and a conductive layer. The substrate includes a first through-hole, and a second through-hole. The conductive layer is disposed on one surface of the film to extend in a first area, a second area and a third area of the film. The substrate includes a first surface and a second surface facing away from the first surface. The first area is bonded to the first surface of the substrate such that a housing part is formed by closing one opening of the first through-hole, and such that a part of the conductive layer is exposed to the inside of the housing part. The second area is disposed inside the second through-hole, and the third area is bonded to the second surface of the substrate such that a part of the conductive layer is exposed to the outside.