Invention Grant
US09284645B2 Electroless method for in-line metallization of substrates by spraying them, with prior surface treatment and device for implementing the method
有权
通过喷涂它们进行基板的在线金属化的化学镀方法，用现有的表面处理和用于实施该方法的装置
- Patent Title: Electroless method for in-line metallization of substrates by spraying them, with prior surface treatment and device for implementing the method
- Patent Title (中): 通过喷涂它们进行基板的在线金属化的化学镀方法，用现有的表面处理和用于实施该方法的装置
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Application No.: US13056090Application Date: 2009-07-30
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Publication No.: US09284645B2Publication Date: 2016-03-15
- Inventor: Samuel Stremsdoerfer
- Applicant: Samuel Stremsdoerfer
- Applicant Address: FR Saint Cyr Au Mount D'Or
- Assignee: Jet Metal Technologies
- Current Assignee: Jet Metal Technologies
- Current Assignee Address: FR Saint Cyr Au Mount D'Or
- Agent James C. Lydon
- Priority: FR0855262 20080730
- International Application: PCT/EP2009/059889 WO 20090730
- International Announcement: WO2010/012810 WO 20100204
- Main IPC: B05D3/08
- IPC: B05D3/08 ; C23C18/16 ; C23C18/18 ; C23C18/20 ; C23C18/31
Abstract:
A method of metallizing the surface of a substrate electrolessly, by spraying one or more oxidation-reduction solutions thereonto. The steps of this method include: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in step a), by spraying one or more oxidation-reduction solutions in the form of one or more aerosols thereonto; and c) formation of a top coat on the metallized surface. Compact devices for implementing this method and the products obtained are also disclosed.
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