The electrostatic chucking device 1 of the invention includes an electrostatic chucking portion 2 which includes a plate-like body 11, a top surface 11a of which is used as a mounting surface that mounts a plate-like specimen W, an electrostatic adsorption electrode 12 provided in the plate-like body 11 and a power-feeding terminal 13 that applies a direct-current voltage to the electrostatic adsorption electrode 12; and a base portion 31 that supports the electrostatic chucking portion 2, in which the plate-like body 11 is a corrosion-resistant ceramic, a circular insulation member 21 is provided in a circumferential edge portion between the electrostatic chucking portion 2 and the base portion 31, and a heat radiation plate 34 is provided on the top surface 31a of the base portion 31.