Invention Grant
- Patent Title: Communication module comprised of multiple interdigital transducer duplexers for wireless communication unit
- Patent Title (中): 通信模块由用于无线通信单元的多个指数转换器双工器组成
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Application No.: US13587253Application Date: 2012-08-16
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Publication No.: US09287850B2Publication Date: 2016-03-15
- Inventor: Takashi Yamashita
- Applicant: Takashi Yamashita
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2011-180788 20110822
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H04B1/52 ; H04B1/525
Abstract:
A communication module includes a plurality of duplexers, wherein at least either IDT electrodes of transmit filters of at least two of the plurality of duplexers having a different transmit band or IDT electrodes of receive filters of at least two of the plurality of duplexers having a different receive band are composed of a same material, have a same thickness and are provided on a single piezoelectric substrate.
Public/Granted literature
- US20130049882A1 COMMUNICATION MODULE Public/Granted day:2013-02-28
Information query
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