Invention Grant
- Patent Title: Conductive element and method of manufacturing the same, wiring element, and master copy
- Patent Title (中): 导电元件及其制造方法，接线元件和主复印件
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Application No.: US14387145Application Date: 2013-03-08
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Publication No.: US09288891B2Publication Date: 2016-03-15
- Inventor: Kazuya Hayashibe , Hiroshi Tazawa , Shunichi Kajiya
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JP2012-075247 20120328
- International Application: PCT/JP2013/057324 WO 20130308
- International Announcement: WO2013/146331 WO 20131003
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; C23C26/00 ; H05K1/02 ; G06F3/041 ; G09F9/00 ; H05B33/14 ; H05K3/00 ; H05K3/06 ; H05K3/02 ; H05K3/38
Abstract:
A conductive element includes: a substrate having a first wavy surface, a second wavy surface, and a third wavy surface; a first layer provided on the first wavy surface; and a second layer formed on the second wavy surface. The first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship: 0≦(Am1/λm1)
Public/Granted literature
- US20150027759A1 CONDUCTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME, WIRING ELEMENT, AND MASTER COPY Public/Granted day:2015-01-29
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