Invention Grant
- Patent Title: System for mounting and cooling a computer component
- Patent Title (中): 用于安装和冷却计算机组件的系统
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Application No.: US13774766Application Date: 2013-02-22
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Publication No.: US09292057B2Publication Date: 2016-03-22
- Inventor: Aaron R. Cox , William J. Grady, IV , Michael S. Miller , Jason E. Minyard
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Griffiths & Seaton PLLC
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; G06F1/20 ; G06F1/18

Abstract:
A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.
Public/Granted literature
- US20140240920A1 SYSTEM FOR MOUNTING AND COOLING A COMPUTER COMPONENT Public/Granted day:2014-08-28
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