Invention Grant
US09296015B2 Method for manufacturing thick polyimide flexible metal-clad laminate
有权
厚聚酰亚胺柔性覆金属层压板的制造方法
- Patent Title: Method for manufacturing thick polyimide flexible metal-clad laminate
- Patent Title (中): 厚聚酰亚胺柔性覆金属层压板的制造方法
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Application No.: US13328514Application Date: 2011-12-16
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Publication No.: US09296015B2Publication Date: 2016-03-29
- Inventor: Byoung Wook Jo , Ho Sub Kim , Young Do Kim , Weon Jung Choi , Dae Nyoun Kim
- Applicant: Byoung Wook Jo , Ho Sub Kim , Young Do Kim , Weon Jung Choi , Dae Nyoun Kim
- Applicant Address: KR
- Assignee: SK INNOVATION CO., LTD.
- Current Assignee: SK INNOVATION CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2010-0130383 20101220; KR10-2011-0124067 20111125
- Main IPC: B05D3/14
- IPC: B05D3/14 ; B32B15/08 ; B32B15/088 ; B32B37/24

Abstract:
Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.
Public/Granted literature
- US20120156476A1 METHOD FOR MANUFACTURING THICK POLYIMIDE FLEXIBLE METALCLAD LAMINATE Public/Granted day:2012-06-21
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