Invention Grant
- Patent Title: Resistive structure and resistive voltage divider arrangement
- Patent Title (中): 电阻结构和电阻分压器布置
-
Application No.: US14010013Application Date: 2013-08-26
-
Publication No.: US09299484B2Publication Date: 2016-03-29
- Inventor: Adrian Hozoi , Rolf Disselnkötter , Marek Pavlas
- Applicant: ABB AG
- Applicant Address: DE Mannheim
- Assignee: ABB AG
- Current Assignee: ABB AG
- Current Assignee Address: DE Mannheim
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: EP11001582 20110225
- Main IPC: H01C7/22
- IPC: H01C7/22 ; H01C10/16 ; H01C1/00 ; H01C7/00 ; H01C17/065 ; G01R19/00 ; G01R15/04
Abstract:
A resistive structure has an improved electric field profile deposited on the surface of a cylindrical insulating substrate. At least one resistive path or trace is provided with a helix-looking shape and is directly printed on the surface of the insulating substrate. A resistive voltage divider includes first and second resistors electrically connected in series, where each resistor is made of one or more traces of electrically resistive film material applied onto a cylindrical insulating substrate. At least one of the traces is shaped like a helix and is applied onto the substrate by direct printing.
Public/Granted literature
- US20130342227A1 RESISTIVE STRUCTURE AND RESISTIVE VOLTAGE DIVIDER ARRANGEMENT Public/Granted day:2013-12-26
Information query
