Invention Grant
- Patent Title: Miniature wire-bondable capacitor
- Patent Title (中): 微型可焊接电容器
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Application No.: US14010590Application Date: 2013-08-27
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Publication No.: US09299498B2Publication Date: 2016-03-29
- Inventor: Euan Patrick Armstrong , Ali Moalemi
- Applicant: Eulex Corp.
- Applicant Address: US CA Pasadena
- Assignee: Eulex Corp.
- Current Assignee: Eulex Corp.
- Current Assignee Address: US CA Pasadena
- Agency: KPPB LLP
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/30 ; H01G4/232 ; H05K3/32 ; H01G4/012

Abstract:
A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.
Public/Granted literature
- US20140133065A1 3D CAPACITOR Public/Granted day:2014-05-15
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