Invention Grant
- Patent Title: Method for manufacturing PCB
- Patent Title (中): PCB制造方法
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Application No.: US13523990Application Date: 2012-06-15
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Publication No.: US09299528B2Publication Date: 2016-03-29
- Inventor: Wen-Hsin Lin , Ching-Kun Lai , Chien-Hung Chen
- Applicant: Wen-Hsin Lin , Ching-Kun Lai , Chien-Hung Chen
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW97151471A 20081230
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H01J9/24 ; H05K3/00 ; H05K3/34
Abstract:
A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.
Public/Granted literature
- US20120246926A1 Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module Public/Granted day:2012-10-04
Information query
