A packaged IC having laser vias and methods for making the same. The packaged IC includes a die having bond pads thereon, wire bonds contacting the bond pads, and a substrate configured to electrically connect the wire bonds and external package connectors. The substrate includes mechanical vias through the substrate layers and laser vias in an uppermost substrate layer. Each laser via is closer to the die than the mechanical vias that do not overlap or are not covered by the die. The method includes routing traces on uppermost and lowermost layers, the traces electrically connecting a wire bonds and external package connectors, forming mechanical vias through all layers of the substrate, forming laser vias in the uppermost substrate layer, and electrically connecting each wire bond to one trace on the uppermost substrate layer.