Invention Grant
- Patent Title: Substrate bonding system and method of modifying the same
- Patent Title (中): 基材粘合体系及其改性方法
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Application No.: US12844113Application Date: 2010-07-27
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Publication No.: US09299594B2Publication Date: 2016-03-29
- Inventor: Yu-Liang Lin , Weng-Jin Wu , Jing-Cheng Lin
- Applicant: Yu-Liang Lin , Weng-Jin Wu , Jing-Cheng Lin
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; H01L21/66 ; H01L23/00 ; H01L25/065
Abstract:
The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are modified either by re-shaping, by using height adjusters, by adding shim(s), or by zoned temperature control. The modified surface contours of such plates compensate the effects that may cause the non-planarity of bonded substrates.
Public/Granted literature
- US20120024456A1 SUBSTRATE BONDING SYSTEM AND METHOD OF MODIFYING THE SAME Public/Granted day:2012-02-02
Information query
IPC分类:
