Invention Grant
- Patent Title: Lead frame with power and ground bars
- Patent Title (中): 带电源和接地棒的引线框架
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Application No.: US14833135Application Date: 2015-08-23
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Publication No.: US09299646B1Publication Date: 2016-03-29
- Inventor: Shailesh Kumar , Piyush Kumar Mishra
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR,INC.
- Current Assignee: FREESCALE SEMICONDUCTOR,INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor device includes a die having first contact pads and a second contact pad. Signal leads, each having embedded portion and an exposed portion, are electrically connected to respective ones of the first contact pads. A power bar extends in an area between the signal lead embedded portions and the die and has a first side opposing the signal leads and a second side opposing the die. The power bar is electrically connected to the second contact pad. An electrically grounded ground bar extends at least partially in the area. The ground bar has a first portion between the signal lead embedded portions and the first side of the power bar, and a second portion between the second side of the power bar and the die.
Information query
IPC分类:
