Invention Grant
- Patent Title: Semiconductor assembly and method of manufacturing the same
- Patent Title (中): 半导体装配及其制造方法
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Application No.: US14543037Application Date: 2014-11-17
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Publication No.: US09299651B2Publication Date: 2016-03-29
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: BRIDGE SEMICONDUCTOR CORPORATION
- Applicant Address: TW Taipei
- Assignee: BRIDGE SEMICONDUCTOR CORPORATION
- Current Assignee: BRIDGE SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/544 ; H01L23/00 ; H01L21/78 ; H01L21/48 ; H01L23/552 ; H01L23/36 ; H01L21/56 ; H01L23/538 ; H01L25/065
Abstract:
A method of making a semiconductor assembly is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The base carrier provides a platform for the chip-on-interposer subassembly attachment, whereas the interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer and an optional cover sheet or additional buildup circuitry can be provided on the chip.
Public/Granted literature
- US20150137338A1 SEMICONDUCTOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-05-21
Information query
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