Invention Grant
US09299654B2 Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
有权
各向异性导电膜组合物，各向异性导电膜和半导体器件
- Patent Title: Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
- Patent Title (中): 各向异性导电膜组合物，各向异性导电膜和半导体器件
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Application No.: US13713404Application Date: 2012-12-13
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Publication No.: US09299654B2Publication Date: 2016-03-29
- Inventor: Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kang Bae Yoon
- Applicant: Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kang Bae Yoon
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0136330 20111216
- Main IPC: H01B1/06
- IPC: H01B1/06 ; H01B1/24 ; H01B1/02 ; H01B1/22 ; H01L23/498 ; H01B1/20 ; H01L23/00 ; C09J7/02 ; C09J9/00 ; C09J11/08 ; C08K5/00
Abstract:
A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
Public/Granted literature
- US20130154094A1 ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE Public/Granted day:2013-06-20
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