Invention Grant
- Patent Title: Integrated circuit package and method of making same
- Patent Title (中): 集成电路封装及其制作方法
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Application No.: US12467748Application Date: 2009-05-18
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Publication No.: US09299661B2Publication Date: 2016-03-29
- Inventor: Christopher James Kapusta , James Sabatini
- Applicant: Christopher James Kapusta , James Sabatini
- Applicant Address: US NY Cchenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Cchenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Agent Jean K. Testa
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48 ; H01L23/538 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L25/10
Abstract:
An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.
Public/Granted literature
- US20100244235A1 INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME Public/Granted day:2010-09-30
Information query
IPC分类:
